Intel Commits $100 Million to Developing Smart Devices in China

At the Intel Developer Forum in China Tuesday, Intel CEO Brian Krzanich outlined a Smart Device Innovation Center in Shenzhen and  a $100 million investment fund to accelerate innovation of smart devices, including tablets, smart phones, PCs, 2in1s, wearables, the Internet of Things, and other related technologies in China.

During his keynote, Krzanich discussed how Intel and the Shenzhen technology ecosystem can re-ignite growth – both locally and globally – and deliver differentiated computing products and experiences, spanning multiple market segments, operating systems and price points. Also launched at the event, the Intel Gateway Solutions for the Internet of Things (IoT) based on Intel Quark and Atom processors, and demonstrated for the first time SoFIA, Intel's first integrated mobile SoC platform for entry and value smartphones and tablets.

"The China technology ecosystem will be instrumental in the transformation of computing," said Krzanich. "To help drive global innovation, Intel will stay focused on delivering leadership products and technologies that not only allow our partners to rapidly innovate, but also deliver on the promise that 'if it computes, it does it best with Intel' – from the edge device to the cloud, and everything in between."

Intel will establish the Intel Smart Device Innovation Center in Shenzhen to accelerate the delivery of Intel technology-based devices to the China market and beyond. Further accelerating this effort, the Intel Capital China Smart Device Innovation Fund will focus on tablets, smartphones, wearables, IoT and other related technologies in China.

Intel's 2014 LTE platform, the Intel XMM 7260, meets the five-mode requirement of China Mobile today, including support for TD-LTE, and TD-SCDMA protocols required in China. Krzanich demonstrated the 7260 by conducting the first public, live call using China Mobile's TD-LTE network, and spoke to strong ecosystem demand for a competitive LTE alternative. Intel is also developing its SoFIA family of integrated mobile SoCs for entry and value smartphones and tablets.

Growing the Internet of Things

At the Developer Forum Krzanich also announced availability of the Intel Gateway Solutions for IoT, an integrated solution based on Intel Quark and Atom processors, in addition to an Intel Galileo-based development platform. The first platforms integrate Wind River and McAfee software to help accelerate time to market and will be available from the ecosystem this quarter.

With the Intel Edison set for release later this summer, Krzanich noted that Intel is expanding Edison to a family of development boards that will address a broader range of market segments and customer needs. The first Intel Edison board will now include use of Intel's 22nm Silvermont microarchitecture in development of a dual core Intel Atom SoC, increased I/O capabilities and software support, and a new, simplified industrial design.